Printed circuit board and electro application

ABSTRACT

A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2009-0069666, filed with the Korean Intellectual Property Office onJul. 29, 2009, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND

1. Technical Field

The present invention relates to a printed circuit board and anelectronic product.

2. Description of the Related Art

As the operating frequencies of electronic products become higher,electromagnetic interference (EMI) has been perceived as a chronic noiseproblem. Particularly, the operating frequencies of electronic productshave reached a few ten MHz, or even a few GHz, making the EMI problemsmore serious. Subsequently, finding a solution to the problems isdesperately needed. Among the EMI problems occurring at a board, asolution for the noise problems particularly occurred at the edge of theboard has not been sufficiently researched, making it difficult tocompletely block the noise at the board.

EMI noise refers to a noise that creates a noise problem caused byinterference when an electromagnetic (EM) wave generated in oneelectronic circuit, component or part is transferred to anotherelectronic circuit, component or part. The EMI noise can be broadlycategorized into two types, namely radiation noise (reference numerals110 and 130 in FIG. 1) and conduction noise (reference numeral 120 inFIG. 1).

The EMI noise radiated from a board of an electronic product may becommonly shielded by covering an upper portion of the board by use of ashield can (40 of FIG. 2) or by absorbing the EMI noise by attaching anEMI field absorber (42 of FIG. 3). However, in the case of using theshield can 40, since a new radiation noise 10′ is generated due to theantenna effect, it is difficult to shield all EMI noises radiatedtowards the outside of the board, and there are limitations to frequencyranges that can be absorbed by the EMI field absorber 42, making iturgently needed to find an effective shielding method.

The shield can 40 has some problems in attaching itself. Furthermore,not only is the thickness of the shield can restricted, but also theshield can increases the weight of a lightweight electronic device.Also, in the case of the EMI field absorber 42, it is difficult todevelop a material that can shield the EMI noise in various frequencies,and it may take longer to develop the material, thereby increasing theproduction cost.

Therefore, it is desperately needed to find a solution that can readilyabsorb various frequencies, be easy to apply without any antenna effectand be cost-effective in manufacturing.

SUMMARY

The present invention provides a printed circuit board and an electronicproduct that can readily absorb various frequencies, be easily appliedwithout any antenna effect and be cost-effective in manufacturing.

An aspect of the present invention provides a printed circuit board thatincludes a first board, which has an electronic component mountedthereon, and a second board, which is positioned on an upper side of thefirst board and covers at least a portion of an upper surface of thefirst board and in which an EBG structure is inserted into the secondboard such that a noise radiating upwards from the first board isshielded.

The second board can be adhered to the upper surface of the first boardby way of adhesive, and can be coupled to a shield can covering at leasta portion of the upper surface of the first board. Here, the shield canbe connected to a ground of the first board, and the EBG structure ofthe second board can be grounded to the shield can. Also, an open holecan be formed in the shield can, and the second board can be coupled toa portion of the shield can in such a way that the open hole is covered.Here, the open hole can be formed in an upper surface of the electroniccomponent.

The electronic component can be mounted on a surface of the first board,and the second board can be stacked on the upper surface of the firstboard while a portion corresponding to the position of the electroniccomponent is opened.

The second board can include a first conductive body and a secondconductive body, which are disposed on a different surface,respectively, a third conductive body, which is disposed on a surfacethat is different from that of the second conductive body, and astitching via unit, which connects the first conductive body to thethird conductive body through the surface on which the second conductivebody is disposed and in which the stitching via is electricallyseparated from the second conductive body.

The second board can include a pair of fourth conductive bodies, whichare separately disposed on a same surface, a fifth conductive body,which is disposed on a surface that is different from that of the fourthconductive bodies, a sixth conductive body, which is disposed on asurface between the fourth conductive bodies and the fifth conductivebody, and a stitching via unit, which connects the pair of fourthconductive bodies to each other through the fifth conductive body and inwhich the stitching via unit is electrically separated from the sixthconductive body.

The second board can also have a bent shape corresponding to the shapeof the first board.

Another aspect of the present invention provides an electronic productthat includes a case, a first board, which is placed inside the case,and a second board, which has an EBG structure inserted therein and inwhich the second board is coupled to an inside of the case facing thefirst board so as to shield a noise radiated from the first board.

The second board can include a first conductive body and a secondconductive body, which are disposed on a different surface,respectively, a third conductive body, which is disposed on a surfacethat is different from that of the second conductive body, and astitching via unit, which connects the first conductive body to thethird conductive body through the surface on which the second conductivebody is disposed and in which the stitching via is electricallyseparated from the second conductive body.

The second board can include a pair of fourth conductive bodies, whichare separately disposed on a same surface, a fifth conductive body,which is disposed on a surface that is different from that of the fourthconductive bodies, a sixth conductive body, which is disposed on asurface between the fourth conductive bodies and the fifth conductivebody, and a stitching via unit, which connects the pair of fourthconductive bodies to each other through the fifth conductive body and inwhich the stitching via unit is electrically separated from the sixthconductive body.

The second board can have a bent shape corresponding to the shape of thefirst board.

Additional aspects and advantages of the present invention will be setforth in part in the description which follows, and in part will beobvious from the description, or may be learned by practice of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 3 are cross-sectional views illustrating a printed circuitboard in accordance with the related art.

FIGS. 4 to 7 are cross-sectional views illustrating printed circuitboards in accordance with some embodiments of the present invention.

FIG. 8 is a plan view illustrating a second board of a printed circuitboard in accordance with an embodiment of the present invention.

FIG. 9 is a cross-sectional view of an electronic product in accordancewith an embodiment of the present invention.

FIGS. 10 to 14 show EBG structures inserted in a printed circuit boardin accordance with some embodiments of the present invention.

DETAILED DESCRIPTION

As the invention allows for various changes and numerous embodiments,particular embodiments will be illustrated in the drawings and describedin detail in the written description. However, this is not intended tolimit the present invention to particular modes of practice, and it isto be appreciated that all changes, equivalents, and substitutes that donot depart from the spirit and technical scope of the present inventionare encompassed in the present invention. In the description of thepresent invention, certain detailed explanations of related art areomitted when it is deemed that they may unnecessarily obscure theessence of the invention.

A printed circuit board and an electronic product according to certainembodiments of the present invention will be described below in moredetail with reference to the accompanying drawings. Those componentsthat are the same or are in correspondence are rendered the samereference numeral regardless of the figure number, and redundantdescriptions are omitted.

A printed circuit board according to an embodiment of the presentinvention provides a structure in which an EMI noise radiated from anelectronic component 110 or a driving circuit driving the electroniccomponent 110 that is mounted on a board can be shielded by covering theupper surface of the board, on which the electronic component 110 ismounted, with another board into which an EBG structure is inserted. Forthis, the printed circuit board according to an embodiment of thepresent invention includes a first board 100, which has the electroniccomponent 110 mounted thereon, and a second board 200, which ispositioned on an upper surface of the first board 100 and covers atleast a portion of the upper surface of the first board 100 and in whichan EBG structure (refer to the reference numerals 280 a, 280 b, 280 cand 280 d of FIGS. 10 to 14) is inserted in such a way that a noiseradiating upwards from the first board 100 can be shielded.

The second board 200 is a separate board that is different from thefirst board 100, on which the electronic component 110 is mounted, andcan shield a noise by having the EBG structures 280 a, 280 b, 280 c and280 d inserted therein. Here, the EBG structure can be constituted by ametal layer, a via and a pattern, which are formed inside the board.

As such, the printed circuit board according to this embodiment canprovide a desirable or even better noise shielding effect with lowercosts than the case of using an absorber, by adding the second board 200only without using an expensive absorber (42 of FIG. 3) so as to shiedthe noise radiating upwards from the first board 100. Also, this canprovide a far better noise shielding effect than the conventionaltechnology using a shield can (40 of FIG. 2) only because there is noantenna effect occurred.

Various possible embodiments of the EBG structure, which is insertedinto the second board 200, will be described later.

The second board 200 can be coupled to the upper surface of the firstboard 100 by use of an adhesive 290. More specifically, if theelectronic component 110 is mounted on the surface of the first board100, as illustrated in FIG. 4, the second board 200 can be coupled tothe upper surface of the electronic component 110 through the adhesive290. A solder resist 270 can be formed on an opposite surface on whichthe adhesive 290 is not coated so that the various patterns forming theEBG structure can be protected.

Meanwhile, as illustrated in FIG. 5, in case the upper surface of thefirst board 100 is covered by the shield can 300, the second board 200can cover the upper surface of the first board 100 by being coupled tothe shield can 300.

Also, in case the shield can 300 is connected to the ground of the firstboard 100 through a solder (not shown), the EBG structure can beconnected to the ground (not shown) of the first board 100 by making theEBG structure of the second board 200 grounded to the shield can 300.With this configuration, the ground can be obtained more widely, thusimproving the noise shielding effect.

For this, as illustrated in FIG. 6, the second board 200 can be fixed tothe shield can 300 by using a fixing means such as an adhesive tape 205after a portion of the EBG structure of the second board 200, i.e., ametal layer or pattern, is disposed to be adhered to the shield can 300.In FIG. 6, the adhesive tape 205 covers the entire upper surface of thesecond board 200, but it shall be apparent that it can also cover aportion of the second board 200 only, depending on the designspecifications.

Although the second board 200 can be coupled to the entire lower orupper surface of the shield can 300, it is also possible that the secondboard 200 is coupled to a certain portion of the shield can 300 only. Inthis case, as illustrated in FIG. 6, an open hole 310 can be formed inthe shield can 300, and the second board 200 can be coupled so as tocover the open hole 310. As such, by selectively disposing the secondboard 200 on a certain portion, the noise in the portion desired by theuser can be selectively shielded, and the excessive use of the secondboard 200 can be prevented so that cost-saving can be expected.

Considering that noise is usually radiated upwards from an electroniccomponent, the open hole can be formed in a portion of the shield canthat corresponds to the upper side of the electronic component. However,it shall be apparent that the present invention is not limited to thisembodiment, and the position, number and shape of the open hole can bemodified, depending on the design specifications.

Meanwhile, if the problem is a noise radiated from a driving circuitaround the electronic component 110, rather than a noise radiated fromthe upper surface of the electronic component 110 mounted on the firstboard 100, the second board 200 can have a portion that is openedcorresponding to the position of the electronic component 110 and thenbe stacked on the upper surface of the first board 100. In this way, asillustrated in FIG. 7, the second board 200 can be interposed betweenevery two electronic components 110, and thus the overall thickness ofthe printed circuit board can be prevented from unnecessarily becomingtoo thick.

Meanwhile, if the first board 100 has a shape other than a rectangle,the second board 200 can also have a shape with its perimeter bent tocorrespond to the shape of the first board 100. For example, asillustrated in FIG. 8, a portion of the second board 200 can have asemicircular shape corresponding to the outer shape of the first board100, or a triangle or the like, depending on the case.

The printed circuit board according the previously described embodimentsof the present invention can be applied to various electronic products,such as mobile phones and other mobile devices. In this case, theabove-described second board 200 can be coupled to the inside of a case400 of an electronic product 1000, as illustrated in FIG. 9. In thiscase, the second board 200, into which the EBG structure is inserted,can be easily placed on the case 400 of the electronic product 1000without having an additional shield can.

Next, various possible embodiments of the previously described EBGstructure, which is inserted into the second board 200, will bedescribed below.

First of all, FIG. 10 shows a stitching via-type EBG structure. Abandgap structure 280 a according to the present embodiment can includea first conductive body 230 a-1 and a second conductive body 210 a, eachof which is disposed on a different surface, a third conductive body 230a-2, which is disposed on a surface that is different from that of thesecond conductive body 210 a, a stitching via unit 240 a, which connectsthe first conductive body 230 a-1 to the third conductive body 230 a-2through the surface on which the second conductive body 210 a isdisposed but which is electrically separated from the second conductivebody 210 a.

Described below is the principle by which the structure shown in FIG. 10can function as an electromagnetic bandgap structure blocking a signalof a certain frequency band. Interposed between the second conductivebody 210 a and the first and third conductive bodies 230 a-1 and 230 a-2can be a dielectric layer 220 a. This forms a capacitance componentbetween the second conductive body 210 a and the first and thirdconductive bodies 230 a-1 and 230 a-2 and between the adjacent first andthird conductive bodies 230 a-1 and 230 a-2. In addition, an inductancecomponent is formed between the two adjacent conductive bodies 230 a-1and 230 a-2 by the stitching via unit 240 a connecting through a firstvia 241 a→a connection pattern 243 a→a second via 242 a. Here, the valueof the capacitance component can vary depending on various factors suchas the spaced distances between the second conductive body 210 a and thefirst and third conductive bodies 230 a-1 and 230 a-2 and between thetwo adjacent conductive bodies 230 a-1 and 230 a-2, the dielectricconstant of a dielectric material forming the dielectric layer 220 a andthe size, shape and area of the conductive body. Also, the value of theinductance component can vary depending on various factors such as theshape, length, depth, width and area of the first via 241 a, the secondvia 242 a and the connection pattern 243 a. Accordingly, adjusting anddesigning various aforementioned factors adequately can allow thestructure of FIG. 10 to function as an electromagnetic bandgap structure(i.e. a band stop filter) for removing or blocking a certain noise or acertain signal of a target frequency band. This can be easily understoodthrough the equivalent circuit of FIG. 11.

Comparing the equivalent circuit of FIG. 11 with the electromagneticbandgap structure of FIG. 10, an inductance component L1 corresponds tothe first via 241 a, and an inductance component L2 corresponds to thesecond via 242 a. An inductance component L3 corresponds to theconnection pattern 243 a. C1 is a capacitance component by the first andthird conductive bodies 230 a-1 and 230 a-2 and any other dielectriclayer that may be placed above the first and third conductive bodies 230a-1 and 230 a-2 and the second conductive body 210 a. C2 and C3 arecapacitance components by the second conductive body 210 a placed on thesame planar surface as the connection pattern 243 a and any otherdielectric layer that may be placed below the planar surface of theconnection pattern 243 a and the second conductive body 210 a.

The electromagnetic bandgap structure 280 a shown in FIG. 10 canfunction as a band stop filter, which blocks a signal of a certainfrequency band according to the above equivalent circuit. In otherwords, as seen in the equivalent circuit of FIG. 11, a signal in a lowfrequency band (refer to reference symbol “x” in FIG. 11) and a signalin a high frequency band (refer to reference symbol “y” in FIG. 11) canpass through the electromagnetic bandgap structure, and signals in acertain frequency band (refer to reference symbols “z1,” “z2” and “z3”in FIG. 11) ranging between the low frequency band and the highfrequency band are blocked by the electromagnetic bandgap structure.

Illustrated in FIG. 12 is another embodiment of an EBG structure 280 bthat includes: a pair of fourth conductive bodies 210 b, which areseparately disposed on a same surface; a fifth conductive body 230 b,which is disposed on a surface that is different from that of the fourthconductive bodies 210 b; a sixth conductive body 220 b, which isdisposed on a surface between the fourth conductive bodies 210 b and thefifth conductive body 230 b; and a stitching via unit 240 b, whichconnects the pair of fourth conductive bodies 210 b to each otherthrough the fifth conductive body 230 b but is electrically separatedfrom the sixth conductive body 220 b.

In the EBG structure of FIG. 12, which is a modification of the EBGstructure 280 a of FIG. 10, an additional capacitance component isformed not only between the fourth conductive body 210 b and the sixthconductive body 220 b but also between the fifth conductive body 230 band the sixth conductive body 220 b. Moreover, the via 240 b connectingthe fourth conductive body 210 b to the fifth conductive body 230 b canbe long enough to obtain a sufficient value of the inductance component.Thus, the efficiency of blocking a signal in a certain frequency bandcan be improved.

Illustrated as another embodiment of the present invention in FIG. 13 isa mushroom-type EBG 280 c. The mushroom-type EBG 280 c has a structurein which a plurality of mushroom-shaped EBG cells (refer to referencenumeral 230 c in FIG. 13) are interposed between two metal layers 210 cand 220 c that are to function as, for example, a power layer and aground layer. FIG. 13 shows only four EBG cells 230 c, for theconvenience of illustration.

Referring to FIG. 13, in the mushroom-type EBG 280 c, a metal plate 231c is additionally formed between a first metal layer 210 c and a secondmetal layer 220 c, each of which functions as the ground layer and theother of which functions as the power layer, and the mushroom typestructures 230 c connecting the first metal layer 210 c to the metalplate 230 c with a via 232 c are repeatedly arranged. Here, a firstdielectric layer 215 c is interposed between the first metal layer 210 cand the metal plate 231 c, and a second dielectric layer 225 c isinterposed between the metal plate 231 c and the second metal layer 220c.

In such mushroom-type EBG 280 c, a capacitance component formed by thesecond metal layer 220 c, the second dielectric layer 225 c and themetal plate 231 c and an inductance component formed by the via 232 cconnecting the first metal layer 210 c to the metal plate 231 c throughthe first dielectric layer 215 c are connected in an L-C series betweenthe first metal layer 210 c and the second metal layer 220 c, therebyallowing the mushroom-type EBG 280 c to function as a type of band stopfilter.

Illustrated as another embodiment of the present invention in FIG. 14 isa coplanar EBG 280 d. In the coplanar EBG, a plurality of a certainpattern of EBG cells (refer to reference numeral 220 d in FIG. 14) arerepeatedly arranged throughout any metal layer that is to function asthe power layer or the ground layer. FIG. 14 also shows only four EBGcells 220 d, for the convenience of illustration.

Referring to FIG. 14, the coplanar EBG 280 d has a form in which anymetal layer 210 d and a plurality of metal plates 221 d, which areplaced on another planar surface, are bridged to one another through acertain part of the metal plates (end of a corner of each metal plate inthe case of FIG. 14) by metal branches 222 d.

Here, the metal plates 221 d having a large size constitute lowimpedance areas, and the metal branches having a small size constitutehigh impedance areas. Therefore, the coplanar EBG 280 d becomes tofunction as a band stop filter that can block a noise in a certainfrequency band through the structure in which the low impedance areasand the high impedance areas are alternately repeated.

Such coplanar EBG structure 280 d has a merit that an electromagneticbandgap structure can be constituted by using only two layers.

Although the EBG structure, which is inserted into the second board 200,has been described with four examples 280 a, 280 b, 280 c and 280 d, itshall be apparent that other modifications of the EBG structure can alsobe inserted into the second board 200.

While the spirit of the present invention has been described in detailwith reference to particular embodiments, the embodiments are forillustrative purposes only and shall not limit the present invention. Itis to be appreciated that those skilled in the art can change or modifythe embodiments without departing from the scope and spirit of thepresent invention.

As such, many embodiments other than those set forth above can be foundin the appended claims.

What is claimed is:
 1. A printed circuit board comprising: a first boardhaving an electronic component mounted thereon; and a second boardpositioned on an upper side of the first board and covering at least aportion of an upper surface of the first board, an electromagneticbandgap (EBG) structure being inserted into the second board such that anoise radiating upwards from the first board is shielded, wherein thesecond board comprises a first conductive body and a second conductivebody disposed on a different surface, respectively; a third conductivebody disposed on a surface that is different from that of the secondconductive body; and a stitching via unit connecting the firstconductive body to the third conductive body through the surface onwhich the second conductive body is disposed, the stitching via beingelectrically separated from the second conductive body, and wherein theelectronic component is mounted on a surface of the first board, and thesecond board is stacked on the upper surface of the first board while aportion corresponding to the position of the electronic component isopened.
 2. The printed circuit board of claim 1, wherein the secondboard is adhered to the upper surface of the first board by way ofadhesive.
 3. The printed circuit board of claim 1, wherein the secondboard further comprises: a pair of fourth conductive bodies separatelydisposed on a same surface; a fifth conductive body disposed on asurface that is different from that of the fourth conductive bodies; asixth conductive body disposed between the fourth conductive bodies andthe fifth conductive body; and a stitching via unit connecting the pairof fourth conductive bodies to each other through the fifth conductivebody, the stitching via unit being electrically separated from the sixthconductive body.